From 2014 to 2020, Michael Haney served as Program Director and later Program Director Emeritus
at ARPA-E, while on assignment from the University of Delaware (UD), where he was a Professor of
Electrical and Computer Engineering. At ARPA-E, he led transformative programs in
high-efficiency solar energy and photonic networks for data centers. From 2006-2010, he was a
Program Manager at DARPA’s Microsystems Technology Office, advancing integrated photonics for
applications like bio-sensing and solar cells. In 1998, Haney co-founded Applied Photonics, Inc.
to drive optical interconnect technology. He holds a Ph.D. from Caltech and degrees from
Illinois and UMass Amherst.
Rehan Kapadia
Co-Director MOSIS 2.0
Professor Kapadia joined the University of Southern California's Ming Hsieh Department of
Electrical Engineering in July 2014. He earned his bachelor’s degree in electrical engineering
from the University of Texas at Austin in May 2008 and his Ph.D. from the University of
California, Berkeley, in May 2013. While at Berkeley, he was a National Science Foundation
Graduate Research Fellow and received the David J. Sakrison Memorial Prize for outstanding
research. He has also won an AFOSR Young Investigator Award (2016), an ONR Young Investigator
Award (2021), and the AVS Peter Mark Memorial Award (2020). His research focuses on
next-generation electronic and photonic devices, material growth techniques, and the integration
of compound semiconductors with arbitrary substrates, resulting in over 30 journal articles and
multiple patents.
Christine Lee
Fabrication Services Team Lead
Christine Lee is the Nanofab Process Improvement Team Lead for MOSIS 2.0. Before her role at
MOSIS 2.0, she worked as a process engineer at Northrop Grumman, supporting the Space Park
microelectronics foundry. Christine earned her M.S. in Materials Science & Engineering from UCLA
and holds a B.S. in Materials Science from UC Berkeley. Her educational background and
experience contribute to her expertise in enhancing nanofabrication processes and supporting
advanced semiconductor manufacturing initiatives.
Damon McCaskill
Senior Project Manager
Damon McCaskill serves as the Senior Project Manager for MOSIS 2.0, leveraging extensive project
management experience evidenced by his PMP certification and a background as a former MMIC
Design Engineer in the Aerospace/Defense industry. His expertise in guiding teams through
complex projects and fostering collaboration makes him a vital asset to ISI. Before MOSIS 2.0,
Damon contributed to high-impact projects at Hughes Space and Communications, Boeing Satellite
Systems, Raytheon, and Mercury Defense Systems. He holds a B.S. in Electrical Engineering from
Morgan State University and a Master's in Electrical Engineering from Cornell University.
Lifu Chang
Integrated Circuit Design Team Lead
Dr. Lifu Chang is the Director of Supply Chain at MOSIS 2.0, where he envisions it as a key
provider of semiconductor manufacturing and yield enablement for advanced chip designs. With
over 20 years of experience in semiconductor technology, Electronic Design Automation (EDA), and
Design for Manufacturability (DFM), he has held leadership roles at companies like SMIC,
Qualcomm, and Hisilicon. Dr. Chang pioneered DFM technology and led the development of critical
processes for improving yield and optimizing advanced chip designs. Dr. Chang earned his Ph.D.
from Purdue in 1996, holds multiple patents, published 50 papers, and is an IEEE Senior
Member.
Jeung Hun Park
MPW Services Team Lead
Dr. Jeung Hun Park is a materials scientist and Senior Engineering Manager at MOSIS 2.0,
specializing in material design, synthesis, characterization, and microfabrication. His
expertise includes advanced in situ/operando imaging techniques in reactive environments,
fostering innovation in information display technologies, energy materials, and semiconductor
devices. Previously, he served as the Wafer Fabrication Department Manager at Illinois Tool
Works. He earned his Ph.D. in Materials Science and Engineering from UCLA and has held key
positions at Princeton University, MIT, Columbia University, IBM T.J. Watson Research Center,
and Samsung Electronics, focusing on developing advanced imaging systems, information display,
and semiconductor devices.