MOSIS 2.0 USC Viterbi Information Sciences Institute CA Dreams

Offered MPW Services - Si CMOS, Compound Semiconductor

MOSIS 2.0 offers a comprehensive range of Multi-Project Wafer (MPW) services, supporting both silicon CMOS and advanced compound semiconductor technologies. Our platform provides seamless access to a wide array of commercial silicon MPW services from leading foundries, including TSMC, Intel, Samsung, SkyWater Technology, GlobalFoundries, and Tower Semiconductor. Covering technology nodes from 12 nm to 350 nm and supporting wafer sizes from 100mm to 300mm, MOSIS 2.0 enables the development of diverse applications, from state-of-the-art research to mature silicon-based products.

In addition to silicon CMOS technologies, MOSIS 2.0 collaborates with three DoD-volume fabs—HRL Laboratories, Teledyne, and Northrop Grumman—to offer advanced group III/V MPW services, including GaN HEMT, GaAs HEMT, and InP HBT/HEMT technologies. These partnerships provide industry-leading solutions for high-performance RF, power electronics, and photonic applications. Furthermore, our collaboration with WIN Semiconductors adds cutting-edge GaAs and GaN HEMT MPW services, supporting technology nodes from 100 nm to 500 nm, which are ideal for wireless communication and high-frequency electronic devices.

With comprehensive front-end and back-end capabilities, full customization options, and support for heterogeneous integration, MOSIS 2.0 provides a versatile and robust platform to meet the diverse needs of our customers. We are also actively collaborating with CA DREAMS hub members, other Microelectronics Commons superhubs, and CHES partners, which offer additional resources and expertise to further enhance our MPW services. Our extensive MPW services, combined with comprehensive chip design support, enable innovators to realize their cutting-edge semiconductor products with efficiency and confidence.

MPW Partners

Taiwan Semiconductor Manufacturing Company
Samsung Semiconductors
Skywater Technology
WIN Semiconductors
Northrop Grumman
Teledyne Technologies Incorporated
HRL Laboratories
RTX Corporation
ASU Southwest Advanced Prototyping Hub
Sandia National Laboratories

Tapeout Schedule

Please use the fields below to find a tapeout schedule for our available foundry services.

Our DIB partners' MPW schedules are subject to change based on MOSIS 2.0 and Foundry internal schedules. Additional MPW tape-out opportunities may be available upon request for dedicated MPW services, offering customized scheduling and allocation.

2025 tapeout schedule
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Technology Offerings

Fab Partner Process Offering Technology Node Tapeout Frequency Wafer Size
TSMC MPW Dedicated Si CMOS 12nm, 16nm, 22nm, 28nm, 40nm, 45nm, 55nm, 65nm, 90nm, 130nm 2-10 per year 300mm
180nm, 250nm, 350nm 2-26 per year 200mm
Samsung Foundry MPW Dedicated Si CMOS 28nm, 65nm, 130nm 2-4 per year 300mm
SkyWater Technology MPW Dedicated Si CMOS 90nm, 130nm 2-4 per year 200mm
WIN Semiconductors MPW Dedicated GaAs pHEMT 100nm, 150nm, 180nm, 250nm, 450nm, 500nm 2-4 per year 150mm
GaAs HBT 4th Gen, 5th Gen, 7th Gen 2-4 per year 150mm
GaN HEMT 120nm, 150nm, 250nm, 450nm 2-4 per year 100mm
HRL Laboratories MPW T3 GaN HEMT 40nm 2 per year 100mm
Teledyne MPW TSC250 InP HBT 250nm 3 per year 100mm
Northrop Grumman MPW GaN GaN20_PWR HEMT 90nm, 150nm, 200nm 4 per year 100mm
Sandia National Lab MPW InP PIC 100nm 100mm
RTX Corporation MPW Silicon Interposer 200mm